Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael
I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o
Electronics Forum | Mon Dec 19 08:56:18 EST 2005 | davef
Q1a. If the thickness of the silver is too much (how is too much??), A1a. We have heard stories of using Ag2 to limit silver [or gold] dissolution, but have never seen formal studies to demonstrate that idea. First, exclude the use of silver plate
Electronics Forum | Tue Feb 21 11:59:56 EST 2006 | dannyleach
We design a broad range of DC/DC power supplies for various telecom, internet, and computor applications and have been succesfully using intrusive reflow for ~7 years now. Our pcbs range from 0.065 to 0.090 in thickness and are moslty dense 4 to 8 la
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
Electronics Forum | Sat May 17 09:42:10 EDT 2008 | realchunks
The Optimizer can be run through your wave like a regular board. It measures temps, times and parallelism of your waves in relationship to your board (pot to conveyor). Run the Optimizer till you get you temps, times and are parallel to your waves.
Electronics Forum | Mon Jul 14 16:11:58 EDT 2008 | ck_the_flip
Pat, Try to run a glass plate (yeah I've used these before too), keep your wave pump speed the same, and slow down your conveyor speed. You will find the actual contact between molten solder and the 0.5" grids to be LESS vs. a faster conveyor speed
Electronics Forum | Tue Jul 15 10:05:23 EDT 2008 | patrickbruneel
Ck, Just to make myself clear I am not at all questioning your observations. What am trying to make clear is that when your wave contact area changes when the PC board or glass plate traveling speed is changed, something is wrong!!! Also an 180Deg
Electronics Forum | Mon Aug 25 12:18:10 EDT 2008 | evtimov
I am looking for an inexpensive way to bake just > a few components. would a toaster oven be okay on > the low setting (i would get a thermometer!) do i > need to get something to place the components on? > maybe a silicon cooking mat (not sure a
Electronics Forum | Fri Oct 09 10:57:25 EDT 2009 | clampron
Omid, I have used the DRS24 for many years and have had similar problems with what you are talking about. I do not have any documents but I will tell you what I have seen. It sounds like an inconsistant collpse of the BGA. If one side of the BGA col
