Electronics Forum: says (Page 178 of 447)

Large Voids with Via in Pad

Electronics Forum | Tue Apr 13 10:30:52 EDT 2004 | Ken

Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduous. Gas entrapment is thought to result if one melts before the other (I forget which order). Two profiles may yield different results as determined

Indium NC-SMQ92J paste problems

Electronics Forum | Fri Apr 23 08:20:25 EDT 2004 | babe

Sometimes solder balling is related to oxidized paste or paste that has sat on the pcb too long before reflow. Mostly it is related to process, sorry... Too slow or too fast of a reflow ramp rate. Heating up an assembly too quickly will not allow the

solder iron tips

Electronics Forum | Tue Apr 27 16:51:46 EDT 2004 | russ

Steve, I didn't say "buy metcal" I said to contact them. I agree they are expensive to operate. But they do have a pretty good website and great knowledge on how to select the right tip. The thread poster appears that he needs to start at the begi

MPM screen printer

Electronics Forum | Wed May 19 09:32:28 EDT 2004 | Mr Fix it - MPM

Sounds to me like the driver for the tactile is not working. The tactile has three components to it. The first is the switch, the second is the pneumatic up/down actuator and the third is a small motor in the tactile assembly. The motor has a driv

Fuji Pick and Place Machines

Electronics Forum | Fri Oct 15 19:11:14 EDT 2004 | grayman

Hi, This discussion is really getting long. Fuji and other high speed mounter is great and better than small flexible mounter when it comes to speed.But, I rather suggest a modular mounter specially for subcon companies. Let say we combined 2 or 3 m

Pb free BGA and Sn Pb solder paste

Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz

Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Fri Jun 04 01:16:33 EDT 2004 | Grant

Hi, Thanks for the info, and can you let me know about some of the issues that were seen. We are still not sure which way to go in our decision yet, however from looking at both videos on the machines running, the Fuji's look very fast. The PCB chan

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Fri Jun 04 09:30:43 EDT 2004 | gregf912

Grant, The Fuji chipshooters are built with the same mindset as the hydraulic presses and huge motor lathes that were the CP ancestors. The first Fuji CP was a modified motor lathe. They are solid. I can move a Fuji across the country and not have t

Solder balls

Electronics Forum | Wed Jun 30 10:24:27 EDT 2004 | K

We find keeping the work environment at about 22degC and humidity to about 40-50% is the best way to control the solder balls. Before we took measures we were out of control with solder balls especially in the summer months. We run aqueous solder thr

Immersion Gold

Electronics Forum | Sat Jun 26 15:26:10 EDT 2004 | russ

I am very happy with Alpha Metals WS709 or even WS609. Almost all of our product is Immersion gold and we place down to 16mil pitch every day along with 0201 and uBGA. Immersion gold from my experience, solders extremely well with every paste I hav


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