Electronics Forum | Thu Oct 14 12:12:21 EDT 2004 | Shean Dalton
Hello JB, Based on the double sided assemblies, the misprint cleaning process can demand the cleaning system to remove both raw solder paste from the misprinted side of the board, and, reflowed flux residues from the assembled side. Recognizing and
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis
Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Sun Apr 25 18:25:10 EDT 1999 | Steve Gregory
Hey Guys! Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... Whoever laid this out, I'd like to go and do a "Back to t
Electronics Forum | Sun Apr 25 20:24:03 EDT 1999 | Bubba
| Hey Guys! | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | Whoever laid this out, I'd like to go and do a
Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
