Electronics Forum | Fri Nov 19 11:07:17 EST 1999 | Bob Smith
Hi John, I don't know of any posters etc. but specs. are available free on-line at www.jedec.com for classification, time out of packaging before baking is required, bake times & temperatures. My understanding is that it only causes a problem if th
Electronics Forum | Tue Nov 02 11:44:54 EST 1999 | Wolfgang Busko
Hi Pat, is the soldering Ok when you solder them by hand ? We use some larger ferrite beads with no problems in reflow but I must say that we use a vapour phase and only max 5 parts/PCB. They do have a high thermal capacity and you use a lot of them,
Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Tue Oct 05 02:47:01 EDT 1999 | Eric
| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so
Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern
Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti
