Electronics Forum | Thu Jul 27 14:48:26 EDT 2000 | Bob Barr
Is Mil-I-46058 still an active spec or has it been obsoleted by the Feds in favor of IPC specs? I have an internal process document that is based on IPC requirements, but a customer wants me to use their specs that are based on the mil spec. I am ho
Electronics Forum | Wed Jul 26 16:42:30 EDT 2000 | JAX
P.J., If you are just looking for info try the link below. If you want someone to help you implement the process inside your company you need to get a consultant. You might be able to find a couple hundred on this sight???? That's just my opinion,
Electronics Forum | Wed Jul 19 01:20:17 EDT 2000 | Craig
Does anyone have any experience wave soldering TQFPs. Our R&D is wanting us to do this but we (production) are hesitant. I've found some recommended pad designs and solder theiving designs in a Philips app note "SMD Mounting Methods". The theory look
Electronics Forum | Wed Jul 19 16:28:31 EDT 2000 | Boca
Kinda along the lines 'if it comes we will build it'. Perhaps you can assemble it, I've not done it, but a question to ask a bit earlier is - should we. Check the specifications for the component, published by component vendor. Most of them really
Electronics Forum | Thu Jun 29 09:45:27 EDT 2000 | Paul Wright
JAX, I want to eliminate as much of the confusion up front. If I can point all the folks involved in the design and manufacture to a single source for component descriptions, be it a TI data book, IPC or JEDEC standard, or some other source, I think
Electronics Forum | Fri Jun 30 11:56:54 EDT 2000 | Ioan
Paul, try this, it's an on-line available JEDEC standard. Maybe you will want to buy it, to have it handy. http://www.jedec.org/DOWNLOAD/pub95/default.cfm Best luck from a guy that feels like you. Unfortunately, the info is there, but nobody will
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
Electronics Forum | Thu Jul 06 17:05:49 EDT 2000 | lucky
The best thing to do is to call Fuji America in Chicago (847.821.2401); they will have the correct information. However, before you call determine your needs and then relay them to Fuji. You do not want to invest a lot of money and only utilize it (
Electronics Forum | Mon Jun 26 12:53:15 EDT 2000 | JAX
Armin, I don't think you will have any problems changing to 4.0 but why would you want to? Why change your system software and leave your platform software at an old rev.? Upgrading UPS will be far more benificial. More Vision opportunities, faster p
Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
