Electronics Forum: assembling (Page 182 of 598)

Testing effect of non-clean flux residue on solder joints

Electronics Forum | Thu Nov 02 15:45:04 EDT 2017 | dleeper

For low volume hand assembly, deionized water or IPA should work fine.

flex circuit

Electronics Forum | Thu May 04 13:35:28 EDT 2017 | jmathis

Hello All, I was given an assembled flex circuit PCB and asked how the board was depanelized as there are no view-able witness marks that I can see. Any ideas? Thanks in advance on any insight to depanelizing without leaving witness marks on the F

flex circuit

Electronics Forum | Wed May 31 07:16:06 EDT 2017 | stephendo

Don't rule out the possibility that the board shop depanelized it and it was assembled after depanelization. Been there, dealt with it, expletives deleted.

Any PCB Assembly / EMS in Hong Kong?

Electronics Forum | Thu Jul 20 03:42:58 EDT 2017 | sophyluo1985

Hi Sir, One of my customer whom localed in Hongkong. If you still want to know them, i will send you the contact number. Sophy

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto

I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Wed Jun 28 07:31:48 EDT 2017 | jamesbarnhart

The IPC A-610 is the most widely utilized inspection standard for electronic assemblies is now updated. It is now moved at Revision F and there are things many new things we need to know about this. Plz explain in detail the major updation in this mo

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef

If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components

PIN IN PASTE

Electronics Forum | Mon Jul 10 02:33:48 EDT 2017 | dawson

"The Pin-in-Paste process can be used to solder through hole components using surface mount assembly process steps." I find it at https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5 Hope is helpful

how to assemble the blade on the PCB separator

Electronics Forum | Fri Jul 28 08:58:25 EDT 2017 | sumote

Which one? I have used a HEKTOR. The blade, from what I remember, was held in place with a couple of guide rails and 1 socket head cap screw. Simple, easy, and worked like a champ.

GPD CF9

Electronics Forum | Wed Aug 02 20:19:01 EDT 2017 | davef

In addition to posting here, consider: SMT Equipment & PCB Assembly Machines RFQ [ http://www.smtnet.com/mart/index.cfm?fuseaction=rfq ]


assembling searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

High Precision Fluid Dispensers
Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
Electronics Equipment Consignment

World's Best Reflow Oven Customizable for Unique Applications