Electronics Forum | Tue Feb 04 09:21:48 EST 2020 | nhusa
There are two areas that are important when discussing cooling rate. One is the rate thru the liquidus, where a fast rate produces small grains in the metal and a slow rate results in larger grains. Although smaller grains are stronger normal SM
Electronics Forum | Thu Jun 10 13:29:21 EDT 2021 | edgar_smt_ap
Good morning. What should be the Oxygen content Standard in an Oven? Here in my company, we have an ERSA reflow Oven, and we work with Lead Free solder paste. According to Work Standard documents send by my company corporate, the PPM Oxygen conte
Electronics Forum | Mon Sep 25 20:21:46 EDT 2000 | Dave F
Steve: How bout putting it on pie plate, running it through your reflow oven, and then adding it to your wave solder pot?
Electronics Forum | Wed Sep 06 20:26:35 EDT 2000 | Greg
Hi, anybody there can help me figure out the degree of misalignment specially on RC components when they're inside the reflow oven? thanks
Electronics Forum | Tue Jun 13 22:42:36 EDT 2000 | Dave F
Jeff: Last place I can recall seeing something like that is NASA-STD-8739.3 Requirements like this are not currently in vogue. A modern solder process should conform to J-STD-001, which makes no mention of prebaking boards.
Electronics Forum | Wed May 17 12:27:28 EDT 2000 | JAX
emmanuel, John's right, as long as there is support, nothing changes. Depending on the size of the board fixtures might be a better option over support pins. Unless the pins jump out of the machine and follow it into the reflow oven, You never know!!
Electronics Forum | Wed Apr 05 22:42:28 EDT 2000 | Dave F
George: I would think so. We use an old Vitronics (822??) IR reflow oven to clue SMT adhesives. Gp get 'em!!! Dave F
Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman
We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.
Electronics Forum | Tue Mar 20 18:51:34 EST 2001 | gburson
Another consideration is that heat damage is accumulative. If you have temperature sensitive components, that third reflow may be bringing them close to their failure point.
Electronics Forum | Tue Apr 24 10:37:45 EDT 2001 | caldon
A small SMT line? I have conections for a New screen printer (MPM), Essemtec Placement machine, and Reflow oven (Electrovert) for $100K Let me know how interested you are. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org
.gif)
