Electronics Forum: side (Page 182 of 507)

Re: Poor solderability

Electronics Forum | Wed Feb 09 22:08:45 EST 2000 | Dave F

Russ: You've got stop soft-peddling this stuff. This doesn't sound like "poor solderability." It sounds like "no solderability." It also sounds like you�re dead meat. Three places to call: 1 Board supplier to get their suggestions on unsolderab

Re: Double sided assembly

Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette

Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will

Re: tombstoning after wave?

Electronics Forum | Mon Dec 11 03:46:14 EST 2000 | JohnW

I have to say I've never heard of anything tombstoning over wave, I've seen issues where the glue dot is too high or off to one side creating a poorly seated component that has too big a gap between pad and endcap(and hence an open), but never a tomb

Re: How to do with tombstoning for component '0402'

Electronics Forum | Fri Nov 03 11:08:29 EST 2000 | Phil

Hi there!!! Actually, all mentioned ideas were significantly related to the cause of tombstoning. But, based on what DL said, you have to check the placement of your 0402. Coz, based on experience, i evaluated the different variables for the root

Re: Skewing chip components

Electronics Forum | Thu Jun 22 12:06:10 EDT 2000 | Wolfgang Busko

Hi Sal, I assume your homeplates are designed with the peaks towards the componentcenter. I can imagine that due to placement inaccuracy not both sides sit in the same amount of paste and that wetting difficulties prevent same force factors for both

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca

Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron

Re: PCB finishing

Electronics Forum | Thu Apr 20 05:35:25 EDT 2000 | Keith Stone

Hi Pete We have a Black and Decker Power File and have mounted it on a bench in an enclosure to capture the hazardous dust. We used a hopper (usually used for guttering!) with a wire mesh over the top (static reasons) mounted in the bench top inside

Re: Help Bottom Side Components

Electronics Forum | Wed Apr 12 20:56:18 EDT 2000 | Dave F

Kevin: You're correct. Loose the glue, unless you're waving second side or have real heavy components. Check the archives for component weights, references, and what not. I believe that most people (let's see a show of hands kids) are using two pa

Re: qfp and soic joint Problem

Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca

All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after

About Part descriptions in Panasonic MVII-F chip shooter.

Electronics Forum | Mon Mar 20 13:05:23 EST 2000 | aldo r. maldonado

i am getting a lot of dimension variation in some chip parts (like coils). Using Panasonic MVII-F chip shooter, I am inspecting the part with transmissive lighting (back ligth)centering with the square shape of the part. I attempted to trick the mach


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