Electronics Forum | Thu May 01 13:56:45 EDT 2003 | kmorris
Dave: After the stencil was made with apertures for a connector on this PCB, it was discovered that the connector would have to be handsoldered after SMT reflow. If the solder deposits are left to reflow on the pads, it makes it difficult for the o
Electronics Forum | Wed May 07 09:53:39 EDT 2003 | cyber_wolf
Thanks for the response Dave. FYI: In my experience using the light cure adhesive, I have found that the newer the adhesive is the less prone it is to popping off during a reflow cycle. Also I have found that it only takes a very small amount to sec
Electronics Forum | Mon May 19 09:29:59 EDT 2003 | bradlanger
Dave, We are using Kester Easy Profile 256 No clean Sn62Pb36Ag02. The oven itself is a Dima SMRO-0252 which is a short oven, it has 13" of preheat, 13.5" of soak, 6.25" of reflow, and 10" of cooling on the way out of the oven. We are soldering multi
Electronics Forum | Fri Aug 15 09:56:50 EDT 2003 | russ
A lot of this depends on the initial quality of the OSP. I have had boards that aren't any good being stored air tight for one day. While believe it or not, I recently used boards that were opened and sat for 1 1/2 years and we built them with no pr
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Wed Aug 27 21:04:05 EDT 2003 | Dave
Rich, I use water soluble in a DEK Proflow unit. We can print faster (about 4 times faster), and the paste lasts much longer than it being exposed to air. In addition to this, the prints we have now are even better than with a squeegee. I havn't
Electronics Forum | Fri Sep 26 14:37:23 EDT 2003 | davef
Steve: Thanks for all your contributions to SMTnet. It just goes to show that geologists aren't as bad as they say. Since we can't pillage your office as you're walking out the door, before you leave, would you send all those design standards that
Electronics Forum | Mon Oct 13 10:47:35 EDT 2003 | russ
i think Dave night have meant what do the solder joints look like? (maybe not) Anyway, I personally wouldn't reflow these boards unless you have solder joint failures We (I) used to hardly ever exceed 210 Deg. during profiling until the leadfree stuf
Electronics Forum | Sun Oct 19 19:01:20 EDT 2003 | harotec
Dave and Pete No bad words against a good batch oven. I don't know the APS-oven mentioned but check out the description of the unique temperature-feedback system in our Ecosold at http://www.reflowsystems.com/press/PressReleases.pdf . As a matter o
Electronics Forum | Sat Nov 08 10:04:26 EST 2003 | severs
Once you have selected your plating based on electrical and physical requirments, you should know that there is an inexpensive plastic storage packaging developed by Lucent which can keep any platings solderability from degrading for up to 10 years o
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