Electronics Forum: parts (Page 183 of 1117)

Component soldering strength ?

Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan

Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805

Re: Tombstoning

Electronics Forum | Thu Dec 16 22:59:18 EST 1999 | Lloyd Nelson

Depending on the part say a cc1206 capacitor try a 7 degree theta rotation.

MSH Placement trouble

Electronics Forum | Fri Nov 19 07:45:59 EST 1999 | Claude Couture

Our Panasert MSH is randomly mixing up the parts placement. About 1 in 10,000 placement will be a wrong part. The wrong part may be any other part present on the feeder carriage. A chip resistor 0805 may be replaced by a minimelf or a sot-23. It is

Re: Fuji IPII BGA

Electronics Forum | Fri Oct 29 12:18:45 EDT 1999 | stefano bolleri

We have also placed BGAs with IP-2, with no problems. Ours were 50 mil pitch PBGAs, and as Doug says the perimeter is more than enough to place the part. We have only placed from matrix tray so far. The ONLY problem is the center array, for parts tha

Re: Tombstoning

Electronics Forum | Wed Oct 13 20:15:14 EDT 1999 | Mike S.

I am assuming the parts are good prior to reflow....

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko

| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme

Re: bottom side epoxy

Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris

| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: Help with D^2 Pak on MV100 Chipshooter

Electronics Forum | Wed Sep 22 21:07:00 EDT 1999 | JAX

| Can anyone help with programming a D^2 Pak on a Panasert MV100. I'm having trouble setting up the parts data and teach the component. What should the Up, Down, Left, Right, Component Code, Lead Details, and Cut Lead Settings be? | A link to the pac

Re: Missing SMT Chip Components

Electronics Forum | Mon Sep 13 12:31:41 EDT 1999 | Wolfgang Busko

| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t

Reflow oven for solder side components??

Electronics Forum | Wed Aug 11 13:44:40 EDT 1999 | Paul Wareham

We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or o


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