Electronics Forum | Thu Oct 22 14:20:57 EDT 1998 | Dave F
| Dear Folks: | | I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resou
Electronics Forum | Sun Oct 18 01:55:16 EDT 1998 | PARK KYUNG SAM
WE USE 3 chamber OF Mc-DRY(MODEL NAME). THE MACHINE CAN REMOVE HUMIDITY FROM PARTS IN THE GENERAL PERIPHERAL TEMPERATURE (MAY BE 25-30;CENTIGRADE). AND IT'S CONVENIENT FOR MAN TO PUT OR TAKE OUT COMPANENT FROM CHAMBER BECAUSE THERE IS NO HOT AIR AN
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Wed Aug 12 12:32:56 EDT 1998 | Rich Croteau
Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple p
Electronics Forum | Sat Jul 25 04:48:40 EDT 1998 | Stoney Tsai
Hi, good friends I found this site is so wonderful to learn SMT techniques meaningfully. We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the cabinet
Electronics Forum | Sat Jul 25 01:25:31 EDT 1998 | Chiakl
Hi, I am currently facing alignment problem on TBGA. Before reflow, the alignment is good. After reflow, Most of the TBGA was off the pad by 25% or more. The peak temperature on TBGA is 210 C with liquidus time that about 50 sec. Paste thickness is 7
Electronics Forum | Sat Aug 01 09:19:59 EDT 1998 | Claudio Carnevali
I can explain my experience. I had a no clean paste and in summer I had a lot of problems. Now I have installed and air cooling system and I work with 25�C and 50-55%. I think you'll have less problems but smt problems usually doesn't have only one a
Electronics Forum | Fri Jul 17 12:49:33 EDT 1998 | Aaron Delfausse
We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are ou
Electronics Forum | Mon Jun 22 14:33:59 EDT 1998 | Justin Medernach
| hi all. | I am looking for a oven which can cure the conformal coating providing heat and the humid atmosphere. I am looking for a temperature range of 60 deg C to 80 deg C and a humidity range of around 80%. | Can anybody refer to me the right v
