Electronics Forum: copper thickness (Page 19 of 32)

ENIG switch contacts

Electronics Forum | Fri Aug 05 12:13:28 EDT 2005 | spommer

As part of our conversion to lead-free, I'm redesigning a pcb that had switch contact patterns screened on the board using carbon ink. On the new board, I plan on using the ENIG process and having the switch contacts be patterns of copper with the n

Flux appearance

Electronics Forum | Fri Mar 17 07:42:51 EST 2006 | vicknesh28

Copper is the base material for the lead. It's tin/lead plated. I finally got profile. Here are the parameters" Peak : 219 Max (+) Slope : 2.29 Max (-) Slope : -1.94 Time above 200 deg. C : 50s Time 140C - 160C : 126s Additional info : Stencil thic

Imm Silver tarnish?

Electronics Forum | Tue Sep 02 16:07:04 EDT 2008 | blnorman

Colorization is relatively uniform across the board. "Processing" is first pass reflow. I belive MacDermid is the ImmAg supplier. Plating thickness has not been determined, our XRF is being revitalized. Elemental analysis did show a large copper

Thick Film Screen Printer

Electronics Forum | Sat Aug 13 23:53:02 EDT 2016 | sarason

A Screen printer is similar to a stencil printer,except the screen isn't made from a piece of brass, copper, plastic or stainless steel, with laser cut holes. The screen has a stainless steel , silk or polyester mesh, which is then dipped in a photos

Re: Electroless Tin Plating

Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F

0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren

Board with immersion Tin

Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax

You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int

Solder in via holes causing printing problems

Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe

We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac

pcb manufacturing

Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb

Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4(TG135,TG150,TG170,TG180),Halogen Free FR-4,Ceramic

Making a BGA stand up

Electronics Forum | Thu Jan 16 03:43:42 EST 2003 | johnw

1st off for the forum folk, I don't like the fact that the new system only let's you see the posting your replying too, I'd rather be able to see the thread..... Anyhoo, why this alloy?, it's because it's the device manufacturers preferred and the c

Vapour Phase Reflow Profiling (Would like to understand more on how to determine a PCB's Profile/Recipe)

Electronics Forum | Mon Jun 27 08:18:47 EDT 2022 | kelvinchoong

Hi All, Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON. Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Paramete


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