Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Fri Jul 06 18:17:34 EDT 2001 | davef
We find no solder balls after washing our boards. It works GREAT!!! ;-) Probably more to the point, look at "Circuits Assembly" 7/01, p 40, "Eliminating Solder Beads In No-Clean PCBs". "Solder mask type & composition are the greatest contributor t
Electronics Forum | Mon Mar 17 22:33:02 EDT 2008 | davef
You say, "We run the exact same product leaded and have very little trouble." Did someone remove the solder mask dams from the boards?
Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw
From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce
Electronics Forum | Thu Jul 19 08:00:03 EDT 2001 | doctord
Solder balls or mid chip beads? Remember IPC classification for Class 2 allows mid chip beads encapsulated in flux. Usually on R's and C's first thing I would do is verify .006 laser stencil 10% reduction and the most critical, The paste must be on t
Electronics Forum | Tue Mar 22 11:20:56 EDT 2011 | jercole
NEED HELP!!! I am getting solder splatters on my panels. We produce 100's of different kinds of product and this is the only one that is leaving solder splatters all over the masking. It is however the first time we have used 40 pin QFN's. I don't th
Electronics Forum | Fri Jun 12 11:15:50 EDT 1998 | Ryan Jennens
Hey all! The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pallet w
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle
If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.
Electronics Forum | Tue Dec 29 17:42:27 EST 1998 | Dave F
| Can anyone recommend a solder stop that can be applied by our PCB supplier. Our current material form Tamura Kaken is causing problems. | | The material should be capable of withstanding 1 Surface mount IR reflow cycle and 1 wave solder cycle. | W
