Electronics Forum | Tue Mar 18 14:00:25 EDT 2008 | rrpowers
There are 2 reasons for wanting to change to an enclosed print system: - Reduce solder paste usage. (We run a high volume application so any reduction in paste scrap is a big money saver to our company.) - Improved print quality. (Ours is a non-rew
Electronics Forum | Tue May 06 22:15:06 EDT 2008 | davef
We agree. We consider mounting holes and press fgit socket pads to be "critical contact areas." Consider taking steps to prevent the production of such solder splats on your gold to help elimate gold rework. We discussed this previously here on SMTn
Electronics Forum | Sat May 24 08:47:57 EDT 2008 | davef
Bill Our suggestion removing small QFN is: * Heat the board be from the bottom side using a convective heater. * Use a hot gas or air on the top side of the component. A good starting point is air velocity of 15 to 20 liters per minute. * Select a no
Electronics Forum | Wed Jun 11 08:42:20 EDT 2008 | Daniel
yes I have - at first you should read the following application note: http://www.finetech.de/enid/qfnrework - afterwards you can use the contact form on the right side of the webpage or just take a call and ask for dominik 0049 30 9366810 he can answ
Electronics Forum | Tue Jun 03 13:25:46 EDT 2008 | slthomas
I'm in the same boat and have to pay a little more for the standards I insist on having. You just have to work on your sales pitch a little to convince the powers-that-be that you need it. Just tell them the difference is about $50k/year in scrap and
Electronics Forum | Tue Jul 08 12:11:17 EDT 2008 | gabriella
Hello, you will probably need more temperature. Notebook - probably the board is designed to transfer more heat(insude layers all copper). Tell us more about the problem you have and something about the board. what exactly is your problem? You can't
Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33
5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Mon Sep 01 09:49:54 EDT 2008 | allan99
I told a friend this problem, and he also thinks the problem is the component, and suggested a different solder paste (more acid), maybe you can ask your supplier for a sample and orientation. Until there I think you have to rework if its only one co
Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs
We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y
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