Electronics Forum: rework (Page 184 of 293)

BGA Rework affected by cold weather?

Electronics Forum | Mon Dec 15 18:22:36 EST 2014 | mcapizzi

As was stated, there are a number of variables that could come into play. I have used AirVac DRS26 and SRT Machines. We are now using Shuttle Star which has IR as well as hot air heat. This works much better for us. You can view these at. http://www.

BGA Repair information

Electronics Forum | Fri Dec 12 02:11:35 EST 2014 | acepa

We have 6,000 TI BGA's to remove from a PCBA and reball for reuse. TI DaVinci BGA, DIG, Media, 284 ball part number TMS320DM8148SCYEO Does anyone have a formal repair procedure or knowledge of such rework for such a part they would be willing to sh

Leadfree Rework

Electronics Forum | Thu Jan 29 09:29:42 EST 2015 | rgduval

In general, it depends on what you're working on. Boards with a higher thermal profile might require higher temps. But...the usual answer is...set your irons to the lowest temperature possible that still achieves the goal. We usually keep our ir

BGA Rework (Top side heat only!)

Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06

I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but

BGA Rework (Top side heat only!)

Electronics Forum | Thu Feb 26 12:24:02 EST 2015 | emeto

The best test will be to X-ray BGA under 3-D X-ray. About the techniques used for BGA repair you can probably take closer look to some BGA repair stations, even though I have seen it done with hot air gun in the early days.

LGA Rework

Electronics Forum | Fri Mar 27 13:08:14 EDT 2015 | ppcbs

We reflow solder balls to the LGA using a tacky paste flux. Then we install the LGA to the PCB using a tacky paste flux. This will result in zero voiding and is a preferred method of our Military and Space clients. Be sure to read your spec sheet

Regarding the choosing of right Suface Finishing

Electronics Forum | Wed Apr 29 12:51:09 EDT 2015 | jandon

I have experience of Immersion silver and it's even more sensitive for all disadvantages mentioned above than Immersion tin. You can not go wrong with ENIG. It's little more expensive but in the end you save some bucks when you don't have to rework o

BGA vs LGA. Which to choose?

Electronics Forum | Tue Oct 06 13:46:35 EDT 2015 | deanm

Agree. However the LGA has an even lower standoff, so I would think it would be an even greater challenge. The LGA is a cheaper choice but want to know from those who have done both if the extra cost of the SnPb BGA would pay for itself in lower rew

Regarding BGA Pad Lifting

Electronics Forum | Tue Feb 09 17:11:14 EST 2016 | vaghelarajeshh

I have pad lift issue during the rework on Motorola box DSR600 which has the fault of No log and No boot. Pad lifting pattern is on four corners. I have checked the temeprature difference between the corners which is sam as center. I have attache

High Volume PCB Rework in INDIA, CHINA?

Electronics Forum | Mon May 22 02:18:53 EDT 2017 | hxamalia

Hello guys, Good day , it is Amalia from HX Circuit Technology Co.,Ltd in China, we are a prefessional PCB factory with many years. We are focusing on quick lead time for PCB with good service . please contact with me now ,thanks Email: amalia@hx-c

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