Electronics Forum | Tue Mar 04 09:24:18 EST 2003 | moncav
Because of my invovement with one of the companies mentioned, I will try to be as unbiased as posible. There is an incresing trend toward using this type of support tooling and there are a few players in the game. They each have their own niche in
Electronics Forum | Tue Mar 04 15:46:00 EST 2003 | EW
I'm not sure to what degree you are manually crunching this data.....If you can set up the data manually, or parse the data from a recording function, to allow it to import into a database with a formula for Cpk, and everything else you could ever in
Electronics Forum | Mon Mar 03 11:07:40 EST 2003 | MA/NY DDave
Hi In addition to what DaveF gave you which you should look at first Search the archives for warp bow twist warpage etc. A Lot of treads exist. Many of the larger OEM's and even the Mil have historically created their own documents for acceptable
Electronics Forum | Mon Mar 03 11:12:49 EST 2003 | MA/NY DDave
Hi I have seen a few different ways to do this, including hand solder for certain PIH (pin in hole) components as the last operation. Search the archives would be one place for you to look Buy or Borrow one of the SMT Books out in the market. Ther
Electronics Forum | Mon Mar 10 18:29:00 EST 2003 | Stephen
May I be the first to ask, how you plan on applying paste to the primary SMT? You won't be able to stencil it on as is typical. Do you have a paste dispenser? Also a lot of PTH parts can not take reflow temperatures, not even all SMT parts can. (b
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Tue Mar 04 16:41:42 EST 2003 | MA/NY DDave
Hi I think you answered your own question. How much depth have you already established If 0 than commissions are high and base salary high Without a base salary forget it for a good professional If a cake walk due to past practices than commi
Electronics Forum | Wed Mar 05 13:37:20 EST 2003 | msivigny
Hello James, It sounds like the system that's being used to gather this data is an AOI system. I will investigte this more because I'm very curious of the process in which this works. I'll keep an eye out for someone using this setup and may get back
Electronics Forum | Wed Mar 05 09:34:32 EST 2003 | HAROLD LICHT
WE HAVE A NEED TO BOND SOME LOW TEMPERATURE LED'S TO A THIN CIRCUIT BOARD LAMINATED TO A HEAT SINK. HAS ANYONE USED AN ULTRASONIC WELDER TO WELD COPPER GUL WING LEADS TO A COPPER PAD USING ULTRASONICS? IF NOT HAS ANYONE USED RESISTANCE SPOT WELDING
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