Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef
What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Dec 28 15:35:21 EST 1999 | Mike Naddra
Edmund, An 0603 component should not fall from the board durring an inverted reflow pass, provided that: Your land geometries are correct for the package type (Start with SM 782 guidlines)- as surface tension of the liquidous solder is what holds
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Tue Dec 11 18:32:30 EST 2001 | edmentzer
Does anyone have experience with different colors of solder mask. I am interested to know if a clear or light color mask is better in the reflow process. Most of the boards we do have a green solder mask. It seems to me that I read somewhere that
Electronics Forum | Fri Apr 12 16:30:21 EDT 2002 | stepheno
If you are going to wavesolder the board after SMT you will have to epoxy the parts on instead of paste/reflow. I used to work for a company that squeeged it on. You will have to research component layout guidelines if you do want to wavesolder. If
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Fri Apr 30 10:39:15 EDT 2004 | Bryan She
I found much ICT fails on the same location(Ref.des:Q166) on my boards. 1.Defects rate:more than 20%. 2.We measured the value of the transistor before reflow oven,it's ok.but measure again after been reflowed,result is fail.it seems fails happen duri
