Electronics Forum | Tue Aug 24 12:36:45 EDT 2004 | Cal
Hey Dave I deal with this every day. UGH!!!! We created a Bin location for each of our pick-and-place machines. Once the parts are moved from stock the computer will be updated as SMT 01xxx, SMT 02, and SMT 03 Bin location for that part. SMT01-03 are
Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith
Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp
Electronics Forum | Thu Oct 07 12:14:14 EDT 2004 | bschreiber
The pre-solder cleaning of misprinted PCBs can be a completely different experience from a post-solder application. While the paper that DaveF references is excellent, you may want to read the paper by Richard S. Clouthier, "SMT Stencil Cleaning: A
Electronics Forum | Thu Oct 28 05:35:49 EDT 2004 | rlackey
Dave, I think you'll find you'll score higher if you add a cheeky half twist - you'll get a higher difficulty multiplier on your final score. Profiling is highly dependant on the quality of your oven, number of zones, temperature profiling tools et
Electronics Forum | Tue Nov 02 14:34:29 EST 2004 | bpevear
I agree with DaveF's recommendation to see Foresight's website (www.residues.com). They have excellent Case Studies on display (for free). There is a good case study which references the results you can expect using a ROSE tester vs other control met
Electronics Forum | Wed Nov 10 20:32:59 EST 2004 | Fengang
Hi Dave, Thanks for your reply. I have checked the former thread you gave to me. But I think it's totally not the same thing. I want to know, when we see the component spec -- 260 centigrade 10secs, the 260 centigrade means what? It's the environme
Electronics Forum | Sun Nov 28 03:27:03 EST 2004 | jmedernach
Hi Guy, I see them frequently. Usually, if I have voids on my BGA's, I'll have them on my passives as well as at leaded device solder joints. They run rampant through the entire assembly. For me, it's a function of my profile. I only have a 4 zon
Electronics Forum | Fri Feb 18 10:10:49 EST 2005 | Frank R.
Thanks Dave, The problem is on all 0805. Do you think it could be a reaction with the flux from the wave or the one in the paste. Do you think the problem is the viscosity of the coating. SPEC = Viscosity 150cP nominal ASTM D-1384. I ask you all
Electronics Forum | Thu Feb 24 10:34:02 EST 2005 | Rob
Thanks Dave, From what I remember a lot of components went away from Silver Palladium to "base metal" terminations because of the difficulties in continuation of supply & stability of price. (Something about being mined in Chechnia or the Congo?) W
Electronics Forum | Mon Feb 28 04:10:07 EST 2005 | Rob
Hi Dave, Was planning on skipping the paste step & screen printing the adhesive straight onto the pad, then placing the component into the glue & curing. (Board has LEDs only) Regarding the lead-free HASL issue - not entirely sure on the board man
