Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
Electronics Forum | Tue Feb 06 13:02:36 EST 2001 | kmorris
Hi all: We are seeing "solder webbing" on the bottom side of some of our PCBs after wave solder. The solder is sticking (like a spider web) to the solder mask on the PCB. This is only happening on 2 of the many PCBs we wave on that machine. Both o
Electronics Forum | Tue Apr 10 13:43:13 EDT 2001 | mparker
since you did not define what visual process you are inspecting with I will ask is this "grainy" appearance being detected with the naked eye only? Are you using magnification? if so, what power? Is this a SMT solder or through hole solder problem?
Electronics Forum | Thu May 03 10:14:10 EDT 2001 | davef
Now, I'm not going to talk solder balls, in a traditional sense. I have an image of bilbous, globs of excess solder near the ends of PTH leads. If that's not what you have, ignore the following [and help us understand your situation better] ... Yo
Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin
No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Mon Dec 20 08:26:17 EST 1999 | pascal MATHIEU
hello guys ; we are using some standard selective wave soldering unit used in lined ; the drawback of a such machine is 1/the speed which is quiet low (the board is coming on position through the conveyor, then the head delivering the solder moves s
Electronics Forum | Fri Dec 10 12:40:44 EST 1999 | Brian W.
It sounds like the process is very labor intensive, and all the verification is done after the parts are soldered. Assuming you are hand placing the components: 1 - Contact Systems semi-automatic placement machine. It show polarity when placing, so
Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F
| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
