Electronics Forum | Wed Apr 03 13:32:30 EST 2002 | Bob
Hi, Just to ease your mind a little. I have 15 years experiance on Fuji kit, and was the engineer in charge of over 30 CP6's. They are very robust and the electrical / electronic side is pretty bomb proof. The main thing to look out for is wear in
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Tue May 14 18:07:27 EDT 2002 | soupatech
My method is not good if accuracy is an issue. Most of our reels come with a guage on the back. It is not a perfect count but with a good eye you can get within a couple hundred on reels of 5k. On the reels shipped with no guage I usually just hold a
Electronics Forum | Mon May 20 10:32:19 EDT 2002 | Hussman69
I actually built a dual tank fluxer for my Econo-Pak once to handle the same thing. Not all that difficult if you're mechanically inclined. BUT, for your application I'd recommend just hand spraying the 1 to 4 boards a month with any flux they reco
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Fri Jun 28 16:21:03 EDT 2002 | russ
Is that 5 top and 5 bottom zones? We use a 4 zone and a 3/4 zone oven for BGAs and have success. I don't believe that the amount of zones is the issue but what type of profile you can get out of them. I will admit that the large ovens are much eas
Electronics Forum | Wed Aug 07 08:46:38 EDT 2002 | davef
The time and temperature required for baking moisture from your boards varies according to the conflicting desires to: * Remove enough entrapped moisture. * Desire to retain solderability of solderable surfaces. Search the fine SMTnet archives for s
Electronics Forum | Fri Sep 06 14:35:47 EDT 2002 | bobm
I have been in smt for about 4 yrs. I would say you need to evaluate what type of components you are going to place. How many boards your orders will be for. I use Quad pick and place equipment. These are all around good machines for placing everythi
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
