Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Fri Dec 09 06:25:53 EST 2005 | ajay
thanks for info Most of the defect soldering joint do not take place. Observe that PCB not cleaned properly & also component wetting not good. testing staff expect that all card what ever they receiev shuld be 100% ok. they straight forward complain
Electronics Forum | Wed Jan 11 14:38:37 EST 2006 | cg
We have recently started using lead free solder on our wave. The dross accumulates rather quickly. The dross flakes (tin oxide?) are light enough to sometimes fall or float into the main wave. What kind of quality concerns are there if the dross is m
Electronics Forum | Fri Jan 20 17:04:21 EST 2006 | George
adlsmt, Solder pot temp is set to 265C. About solder joint quality, you must take in consideration the PCB finish when testing different leed-free alloys. Our PCB's are ENIG.
Electronics Forum | Mon Feb 13 12:43:05 EST 2006 | Chunks
Sure, if your solder joints are reliabale after reflow. TZ is right about watching how you mix it, but 9 minutes sounds like it's not moving too fast. What brand of mixer are you using?
Electronics Forum | Tue Jul 18 07:39:52 EDT 2006 | Chunks
Is the hole always in the same solder joint? What parts do you see the hole(s) on? Can you try a different paste?
Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS
Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS
Electronics Forum | Tue Aug 15 17:36:29 EDT 2006 | cuculi54986@yahoo.com
Russ, I believe the concern over solders with bismuth in them was that if you did happen to get a little Pb in your solder joint, you could create an alloy that could melt at around 100 degrees C, and that's not all that warm. At least, that's what
Electronics Forum | Mon Jan 29 20:12:18 EST 2007 | davef
Continuing with Darby's point, the surface area of the pin that is in contact with solder is HUGE. You could pound that pin with a 24oz ball peen hammer and not get it to release from the copper in that through hole.
Electronics Forum | Wed Feb 21 15:31:18 EST 2007 | wavemasterlarry
I talked to our quality director and he says every solder joint had to be 50% of the way up on all the parts to be consisdered good.
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