Electronics Forum: basing (Page 187 of 312)

Re: Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon

| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B

Hand Lotions For Operators

Electronics Forum | Wed Jun 10 21:58:20 EDT 1998 | Dave F

We use them, but we never thought about them. WHAT ARE THEY? The hand lotion we provide for our operators. BACKGROUND: Operators hands take a beating. They 1 Work in a humidity controlled 35 to 50%RH environment that is drying 2 Wash before and

Help me increase my first pass yields

Electronics Forum | Thu Jun 04 11:23:44 EDT 1998 | Frank S

If you could measure and chart 3 variables in my process, what would they be? The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure 7"

Re: Help me increase my first pass yields

Electronics Forum | Thu Jun 04 11:57:59 EDT 1998 | Pete M

Be more specific on your problems? | If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. The

Re: Splicing tape for 8,12, and 16mm component tapes/How 'Bout Carrier Tapes?

Electronics Forum | Thu Jun 04 10:17:09 EDT 1998 | Eric Jenkins

| | Looking for vendors of splicing tape for 8,12 and 16mm tape and reel. | | Any net sources? | If you can use carrier (cover) tapes go see "Igmar Grewar 16:04:32 5/28/98" on SMTNet. Dave F It is very difficult to splice carrier tape, we have tried

QP2 vs GSM

Electronics Forum | Fri May 22 07:59:14 EDT 1998 | Jerry

We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision syste

Re: QP2 vs GSM

Electronics Forum | Thu May 28 18:16:40 EDT 1998 | Ian Bates

| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys

Re: Approach To Contamination Testing Of PCBs

Electronics Forum | Thu May 14 19:05:02 EDT 1998 | Mike Konrad

Dave, Ionic contamination testers are considered to be a valuable tool to determine the cleanliness of both bare boards and post solder boards. There are some instances when SIR testing is more suitable for determining cleanliness than ionic contamin

Re: Industry benchmark ppm number

Electronics Forum | Sat Apr 25 12:58:13 EDT 1998 | Earl Moon

| Is there an industry standard in calculating SMT process | PPM level for benchmarking purpose ? What are the industry | benchmark ppm number for some of the defects like solder | short for 20-mil QFP, tomstone problem for 0603 components etc....

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sun Apr 12 12:55:11 EDT 1998 | Bob Willis

| I would like to invite everyone to share/discuss | information/knowledge/experience they have with | the req's that are assumed to be valid for the | temperature/time relation in the process of reflow | soldering Pin In Paste, Intrusive Reflow or w


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