Electronics Forum | Fri Jul 03 03:47:59 EDT 1998 | chris Link
| | Has anyone experianced Core Dump errors with their MYDATA TP9? | | My machine (2/96) has 26 million placements and my operators | | have recorded 253 core dumps in 1996, 238 in 1997, and 18 in | | January of 1998. We run one job on the machine,
Electronics Forum | Tue Jun 30 09:31:36 EDT 1998 | Earl Moon
| The SMTnet Forum archive listings are now available for public inspection. You can post messages from the archived messages, but it will not place your message in the archived listing. Instead, your message will be placed as a _new_ thread at the t
Electronics Forum | Thu Jun 25 11:53:09 EDT 1998 | Dave F
| | Dennis, thanks for your input. I myself can't remember having any caps fail due to thermal stress/cracking. But the guru's here says it happens and since the assembly is for space flight, it's a requirement to preheat. Also, your process is exac
Electronics Forum | Fri Jun 19 02:02:01 EDT 1998 | Scott McKee
| I am involved in the purchasing decision (Technical side) of which placement machine to buy. One of the criteria we need to specify is how many feeders, and what sizes. I have a provitional parts list of a job that we are most likly going to build.
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Mon Jun 08 21:20:55 EDT 1998 | Dave F
| | | Is there someone who can tell me where I can buy rolls of leader tape for SMT component tapes. Is there a good way of bonding leader tapes, maybe a special instrument to do the job. Thanks for any help. | | Igmar: The following companies suppl
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
.gif)
