Electronics Forum | Wed Jul 07 02:20:48 EDT 2004 | Koki
Please let me know exactly the Koki specification that has managed to solve the balling issue and we can look at the level of residue or the cosmetic may be what you wish to improve.
Electronics Forum | Tue Jun 29 06:43:05 EDT 2004 | davef
Look at: TP-1115 - Selection And Implemetation Strategy For A Low-Residue, No-Clean Process
Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef
Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.
Electronics Forum | Fri Jun 25 11:52:30 EDT 2004 | waveroom
What are the specifications on the solder that you use? IE: Water soluble,RA,RMA, N/C? Also do you clean the boards and if so how and what detergent if any are you using?
Electronics Forum | Fri Jun 25 12:10:34 EDT 2004 | tcp
We use water soluble paste, Kester R560. These units are wave soldered and cleaned in an Electrovert Aquastorm water wash with a 3% Kester saponifier solution in the first stage.
Electronics Forum | Fri Jun 25 13:35:13 EDT 2004 | tcp
We have beaten the reflow profile angle to death and haven't been able to duplicate the condition, so I don't think that is the problem. The voids were visible on the surface of the remaining solder. Where the lead tore out of the solder left indic
Electronics Forum | Fri Jun 25 16:18:26 EDT 2004 | waveroom
For what its worth. Even though you are potting the boards. If for whatever reason flux residue (OA) was left on the board prior to potting this flux could migrate and cause embrittlement problems with the solder joint. I would definately inspect for
Electronics Forum | Fri Jun 25 14:22:40 EDT 2004 | jjh
Will there be any problems with reflow when using CCGAs on nonwoven aramid reinforced pcbs? thanks!
Electronics Forum | Fri Sep 10 11:27:18 EDT 2004 | rlackey
Hi John, We use Spray mount adhesive on durastone pallets, then kapton tape on the egdes. We have produced upto 25K flexi PCB's a day with this method. The trick is to get just the right amount on the pallet, to maintain tackiness. Cheers, Rob.
Electronics Forum | Sun Jun 27 02:23:52 EDT 2004 | mskler
Yes,immediatly means after three days of the SMT production.Actually we are using o clean heraeus Solder paste with 2%AG. The contamination is 90.5%.We are not using any extra flux.
