Electronics Forum: dave (Page 188 of 327)

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Tue Aug 29 19:54:08 EDT 2006 | darby

Dave, The parking is difficult but don't believe the reviewer about the getting a table business. I just walk in and my waiter; Luigi the Unbelievable, goes to my regular table and says, "You! Jackman, Gibson anda McPherson - piss off! Mr Jarvis and

BGA Repair Medium

Electronics Forum | Fri Aug 25 10:29:13 EDT 2006 | Chunks

With tacky flux, the BGA is not as reliable as one that was never repaired. I believe Dave stated that the higher offset may have something to do with it. Also with tacky flux, the ball collapse form side to side varies a bit. Sometimes a ball(s)

RoHS Board Delamination

Electronics Forum | Mon Nov 20 10:40:35 EST 2006 | SWAG

Thanks Mark and Dave. It sounds like our board design and problem areas are similar to yours, Mark. We talked with our customer about the grid pattern but I'm not sure where we are at with that. In reference to the Tg/Td thread, the material is a

Type 3 vs. Type 4 solder paste

Electronics Forum | Fri Nov 10 09:13:34 EST 2006 | russ

Dave hit the cons pretty well for type 4 type 4 is used when you have extremely small apertures and type 3 will not fit into them or release adequately basically. I have not yet had application that requires it but got very close once, .007 circle

Solderbridges wave soldering

Electronics Forum | Fri Dec 01 08:09:08 EST 2006 | CK the Flip

Square-leaded pin headers will typically bridge at the trailing edge (last couple of leads), since during peel-back, the solder at the trailing edge has "nowhere to go". If you have control over designs, ask your designers if they can put solder thi

BGA chip corner epoxy / adhesive?

Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework

Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've

Pin In Paste IPC Guidelines

Electronics Forum | Thu Jan 04 02:25:12 EST 2007 | Loco

Sorry Dave? There is a seperate table safely hidden away in the D version, but i dont know if it is something new. chapter 7 THT - 7.5.5 Supported holes - solder has a table specifically for PIP, table 7-7 Plated trough holes with component leads -

BGA opens

Electronics Forum | Tue Jan 23 17:27:14 EST 2007 | russ

Well I am a CM, it has to be that OSP finsh!!! hahahaha seriously I hate that finish. but this is big BGA and there could be a multitude of issues as you suggested. Do not assume that the boards were 100% tested for all vias and lines unless yuou

Solder Joint

Electronics Forum | Mon Jan 29 14:01:41 EST 2007 | realchunks

Well, they're all "HE"'s, which may be part of the problem (good one Dave) The customer "thinks" there may be a problem but has no actual proof. The part in question is a lug terminal. It's 0.145" by 0.175" and 0.020" thick. They couldn't "see" a

Reflow Oven Cp & CpK Test at customer place

Electronics Forum | Mon Feb 12 10:06:46 EST 2007 | CK the Flip Guy

DaveF, Please define a "Cp/Cpk capable profiler." Do you mean one that has software that automatically calculates this for you? I do this at my company, and we track 2 critical variables - Time Above Liquidous and Peak Temps. and this is done on a


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