Electronics Forum | Fri May 29 22:03:49 EDT 1998 | Tom Gervascio
| | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | Someone from the manufacturer read it and contacted me. He told me the problem has
Electronics Forum | Tue Jun 09 00:53:06 EDT 1998 | Dave M
| | | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | | Someone from the manufacturer read it and contacted me. He told me the problem
Electronics Forum | Fri May 08 16:30:59 EDT 1998 | Chrys
| I am running boards with gold fingers on a pallet for | masking purposes. The pallets worked fine for a while | but know the gold fingers are getting solder on them. We | have tried everythin: new pallets, cleaning the pallet | and board to be s
Electronics Forum | Tue May 19 08:48:05 EDT 1998 | Aric Parr
| | I am running boards with gold fingers on a pallet for | | masking purposes. The pallets worked fine for a while | | but know the gold fingers are getting solder on them. We | | have tried everythin: new pallets, cleaning the pallet | | and boa
Electronics Forum | Tue Apr 28 23:48:20 EDT 1998 | Jojo
| I'd like to find a buyer for the following used equipment: | Make: Universal Instruments | Model: 4713D Adhesive Dispenser | Options: Rotatable dual-dot head (0deg, 90deg) | Price: Asking $4K (No reasonable offer refused) | I should note
Electronics Forum | Tue Apr 14 18:01:28 EDT 1998 | Mike C
We received a letter from IPC concerning patent infringements (patents held by Matsushita Electric Industrial Co.) LTD (Panasonic) that may effect most of us who use adhesive to secure components to PCBs for subsequent wave soldering process. If you
Electronics Forum | Thu Apr 16 11:50:24 EDT 1998 | Gary Simbulan
| O.K., somebody read a probably hand-written 3 as 8. | Under these numbers, I can find at IBM's Patent Server the following other topics: | USP 4,312,692 | http://www.patents.ibm.com/details?patent_number=4312692: | USP 4,314,870 | http://www.pat
Electronics Forum | Fri Apr 03 08:37:10 EST 1998 | Scott Cook
| We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is
Electronics Forum | Mon Mar 16 01:06:25 EST 1998 | Victor Ng
Dear all, Recently I have a problem of non-wetting at our wave soldering process. It appears only on the SMT pads for the chip components (at the solder side) of the HASL PCB. With all the same parameters on the wave soldering machine, i
Electronics Forum | Tue Mar 10 21:40:27 EST 1998 | Carl mitchell
| I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles mak
