Electronics Forum: solder (Page 1875 of 2103)

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

Flux Designations and Composition

Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD

Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from

Solid Solder Deposit

Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe

wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe

Re: PCMCIA QFP Process Issue

Electronics Forum | Tue May 23 20:44:13 EDT 2000 | Dave F

Sal: You and Wolfgang are spot on, but let's see if we can blow this out a bit. Before proceding to rattle on ... � PC Card. A credit card-size computer peripheral that add memory, mass storage, and I/O capabilities to computers in a rugged, compa

Re: Trimming leads

Electronics Forum | Sat Feb 05 14:51:08 EST 2000 | Bill Petlock

Casimir, The Q and other lead trimmers work extremely well if properly used. Blade life is directly proportional to to the height of the cut. There are a few factors that are very important in trimming. You are working with a solid carbide blade whi

Re: Immersion Gold

Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko

| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se

| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu

Re: Parylene Coating of Plastic Parts

Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian

Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to

Re: Bga reballing

Electronics Forum | Mon Jul 26 15:25:27 EDT 1999 | APE South, Jack Reed, Asian Sales Administrator

Dear Mr. Park, Ahn yahn haseo and good day to you. If you are currently in Korea, APE has a direct representative there, Omni-Create in Seoul who can give you full information on BGA reball kits available. Essentially, reball kits are custom made t

Re: BGAs and vapor phase

Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko

| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi


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