Electronics Forum: 2010 (Page 189 of 248)

Solder dross / voids in our wave solder process

Electronics Forum | Thu Apr 01 14:43:26 EDT 2010 | cbart

You say its in both smt and through hole, but, are you waving the SMT parts as well, I assume yes since you think its dross in the joints. Questions: 1- do you have higher mag scopes that you can zoom in a little more to see if these are voids or dr

Multilayer PCB X-ray inspection

Electronics Forum | Thu Apr 15 10:44:28 EDT 2010 | dwonch

Dumb question maybe but does the board have a layer count window? Usually each layer has it's number visible in copper somewhere on the board and the shop will leave the solder mask clear of this window. If the layers were stacked incorrectly it woul

VIOS Interpretation

Electronics Forum | Thu Apr 08 13:28:24 EDT 2010 | mabdalla

Thanks DucHoang, One more favor. Will really appreciate if you can point us on how to figure out the number of patterns (number of offsets) from the VIOS file. Also we would like to know the feeder types represented by the numbers in the &F sectio

Top camera inspection and side camera

Electronics Forum | Fri Apr 02 04:02:18 EDT 2010 | manju2cool

Hi, I think concept of inspection through AOI is changing. I am struck in confusion.Because some manufacturer say 3D inspection, with 1+4 cameras is ultimate solution. Orbotech also came with 13 cameras at once!Now some say, all these are eyewashing

Top camera inspection and side camera

Electronics Forum | Fri Apr 02 14:11:21 EDT 2010 | bigdaddysoy9

Manjunath, I prefer orthogonal systems. In my experience they are actually better at detecting coplanarity and HIP defects than multi camera systems. They are obviously limited, in that they can not inspect a component under another component, b

Cleaning BGA pads prior to rework

Electronics Forum | Fri Apr 09 07:47:51 EDT 2010 | jdengler

Hi John, Our ERSA rework station came with a soldering iron that has a few special tips. We normally do not have a stencil and use tacky flux, so I use the concave tip to prep the pads. This leaves solder on the pads but with a little practice you

Why Don't Threads Post Properly?

Electronics Forum | Thu Apr 08 14:57:15 EDT 2010 | davef

Why don't threads post in proper sequence? Look here: * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=61576 * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=61574 * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=6

Bad wetting after reflow

Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010

Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with

Bad wetting after reflow

Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef

So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint


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