Electronics Forum | Wed Apr 06 06:25:56 EDT 2022 | bukas
I had the same looking coating on solder joints when we used rosin in IPA. after switching to water based no clean it never happened again.
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Tue Feb 16 12:14:12 EST 1999 | Gregg Reick
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell
I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Thu May 26 06:59:06 EDT 2005 | CLampron
Good Morning, We have several Mirtec table top machines. We bought the first one when it was under the Samsung name. We had the advantage of doing a side by side comparison with several other systems. The Mirtec was the leader in performance. Since
Electronics Forum | Tue Apr 10 11:39:29 EDT 2001 | brownsj
One of the reasons for a grainy joint is the cooling of the joint after reflow. Check your reflow profile, not just the preheating and reflow section but also the cooling zones. It works the same way as molten rock. If it cools slowly you get pumice
