Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Fri Jul 09 11:28:24 EDT 1999 | Earl Moon
| Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts. | Carol, Don't blame you f
Electronics Forum | Wed Jul 07 16:56:43 EDT 1999 | John Zizzo
Hi! I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformity h
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Sun Jun 27 06:27:15 EDT 1999 | Vic Lau
| I am looking for a way to clean solder off of QFP packages. I'm thinking a chemical method would be easy, as long as the chemistry doesn't attack the leads themselves, or the package. | Any suggestions? | Dear Matt, I have a customer, who is com
Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea
| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra
Electronics Forum | Fri Jun 18 15:39:47 EDT 1999 | Earl Moon
| What's wrong with the Tin? Just wondering | | MDCox | | | | Electroless silver had promise, from Alpha, but I don't know where this ended up. Also Omikron's "white" electroless tin is proported to be a good alternative, though I've never been a
Electronics Forum | Fri Jun 18 14:19:29 EDT 1999 | Earl Moon
| | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave re
Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory
| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave
