Electronics Forum | Wed May 04 11:54:29 EDT 2005 | HOSS
Rob, Are you hinting that the lead content of this component with dipped tin/lead solder would not be an issue with RoHS? If so, our understanding is that the legislation requires that the 6 banned substances cannot exist at greater than X% in any
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Tue Jul 26 20:43:46 EDT 2005 | davef
And the reason the connectors aren't on one side of the board is ... Thougts are: * Pealable temporary solder mask * Removable boots Sources of boots that may be ESD protected are: * Kinnarney Rubber; 450 Main St PO Box 37 Mantua, NJ 08051; 856-468
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Tue Nov 15 16:57:22 EST 2005 | bk
If your problem is happening part way through the calibration the problem might be there is too much friction from your Y-wagon. Measure the friction on the Y-wagon using the service program if it fails or if it is near the max allowed try oiling up
Electronics Forum | Wed Nov 23 17:50:40 EST 2005 | adlsmt
I am not aware of any such info so you may not get any replys on this but each of these systems is totally different. There is usually not much overlap of what is the right choice for an application. The solder bath machines with fixtures are for hig
Electronics Forum | Fri Dec 09 02:20:47 EST 2005 | Mike_Kennedy
Grant, I dont quite understand the implications my self yet on gold deposit using FLASH or ENIG. However the important part of the gold finish is that it is kept under 3% of the total solder joint, so normally its safe. With the FLASH process it is m
Electronics Forum | Mon Jan 30 06:29:51 EST 2006 | slaine
we shouldnt be talking about lead free we should be talking in terms of RoHS compliant. HMP solder is exempt in the directive even though it has a hig lead content (93.5%) as no other alloy will melt at the same temperatures 298. as HMP is exempt wi
