Electronics Forum | Fri Aug 10 16:22:35 EDT 2007 | htran
Davef, The J Standard-001-DS(Ref. 4.9.3)does required board assembly bake out and the purpose of the bake out is to demoisturize the PWB and to prevent board delamination during reflow like you have mentioned earlier. Thanks for your inputs. I hav
Electronics Forum | Wed Oct 24 01:44:49 EDT 2007 | darby
Will do Dave - we will have to eat humble pie though. Have just been informed that part is in fact correct value. Problem was caused by different markings on two different supplier cases. Marking on one was 222, on t'other twas 2201,this was interpr
Electronics Forum | Fri Nov 09 19:31:43 EST 2007 | yshiau
Thank you to Dave and Scott!! What I'm delaing with is mass production test for small memory cards in volume! The reason I choose Non-operating temperature cycling is so that I can deal with volume. I can throw in quite a few memory cards in chambe
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Sat Jan 19 10:56:26 EST 2008 | slthomas
Dave that's actually what I want to work on the next time we run these. Our issue with these right now is that weight distribution on the boards mandates that we break a 4-up panel into two pieces and run it 90 degrees to the ideal orientation (=s wh
Electronics Forum | Tue Jan 22 15:54:10 EST 2008 | patrickbruneel
Stephen good observation It�s a spelling error it should be �more� instead of less. Like Dave said �[Too bad they can't afford a spell checker, eh?]� Technically correct is all equipment requiring a power source of more than 1000V AC or 1500V DC ar
Electronics Forum | Tue Jun 03 01:03:04 EDT 2008 | daxman
Hi, I think what you are describing is a half-etch QFN, which causes the 3 mil gap. In our process, we don't require solder to bridge this gap as it's internally connected to the bottom lead. I'm not sure if this is the question you're asking, but
Electronics Forum | Thu Oct 23 12:50:28 EDT 2008 | gregoryyork
Hi Dave sorry not been back the Tin/P regenerator is controlled amounts of Phos additive that metallurgically reduces the dross. We do not recommend chemical methods for dross reduction as many salts/chemicals used could be hygroscopic in nature and
Electronics Forum | Tue Oct 21 07:44:44 EDT 2008 | patrickbruneel
Dave, I know that black pad isn't solderable by any alloy. But it's still justified to relate the nickel barrier plated boards to lead free. Before lead free the predominant board plating was HASL and OSP. These platings disappeared with the switch
Electronics Forum | Mon Nov 03 11:20:08 EST 2008 | boardhouse
Vlad, That was a bad statement to make... Enig should never be thicker than 5 micro inches max. or it will cause embrittlement. This process does self limit but it can put on as much as 10-14 Micro inches which would be a major cause of concern.
