Electronics Forum | Fri Dec 17 08:46:39 EST 2004 | pjc
They have some with VOC content and others without, or very very low content that it will pass NJ and CA emmissions, which are the toughest in the USA.
Electronics Forum | Fri Feb 11 17:07:39 EST 2005 | davef
Your site takes day to download. Please add a button that allows by-passing all the graphics and whatnot.
Electronics Forum | Fri Feb 11 19:13:09 EST 2005 | primus
Your site takes day to download. Please add a > button that allows by-passing all the graphics > and whatnot. Note on front page: REQUIREMENTS Netscape or IE 4.0 or higher BROADBAND CONNECTION That might help...
Electronics Forum | Thu Mar 17 10:30:06 EST 2005 | davef
This happens. You may need to put a dot of chip bonder on the corner of the floating QFP after first pass. What size are the QFP that are moving?
Electronics Forum | Sun Mar 20 04:49:10 EST 2005 | Grant
Hi, Can you guys cascade the line, with a board flipper, printer, placer and oven all in the same line, so you can do both sides in the same pass? The product then leaves the line finished. Regards, Grant
Electronics Forum | Mon Apr 25 05:37:35 EDT 2005 | Bryan
Some weeks has passed,Can SMT eng. show us your results of this issue?so that we can learn something from it
Electronics Forum | Thu Apr 14 11:03:51 EDT 2005 | patrickbruneel
All possible causes aside, how can a dead short pass your ICT unless the connector is not probed.
Electronics Forum | Tue Apr 19 19:06:14 EDT 2005 | Dreamsniper
Kick Out the Salesman from your manufacturing floor! We had that when I was with Commodore B.V. and if you use their tester it passes but if you use other ESD testers it fails. crap!
Electronics Forum | Thu Apr 21 16:27:33 EDT 2005 | Dave G
Look at your component datasheets. Most specify # of reflows & max temps. Most discretes are only rated for 2 or 3 reflows max. Why do you need so many reflow passes ? Dave G
Electronics Forum | Tue Jun 21 11:46:04 EDT 2005 | kenscj
Hi dave, Thanks for the comment. I have another issue. The board already pass Test and Burn-In processes, but after 2 months the BGA contact is found open (no contact on certain balls). How can that happen? Is it during build, the solder ball alrea
