Electronics Forum: defect (Page 192 of 226)

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Wed Mar 25 19:31:13 EST 1998 | Earl Moon

| | We are having some problems with "drawbridging" on 0805 film capacitors. | | We have already reduced the pad width from .050" to .040" based on input | | from vendor. Defects appear to be random as far as location on the PWB and direction | | o

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Sun Mar 29 15:42:05 EST 1998 | Michael Fogel

| | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | We have already reduced the pad width from .050" to .040" based on input | | | from vendor. Defects appear to be random as far as location on the PWB and direction

Re: Film Capacitors - Tombstoning or Drawbridging Problems

Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon

| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Wed Mar 18 13:21:26 EST 1998 | Earl Moon

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: Paladium Pillows and Bad Dreams

Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory

Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT

Re: STATISTICAL PROCESS CONTROL. 6-SIGMA

Electronics Forum | Wed Jan 14 08:24:07 EST 1998 | Allison

Good luck in your conquest. I have been struggling with the same issues for some time now. I have made the following conclusions. First, it is nearly impossible to establish parameters in SMT to perform X-Bar and R charts. Electronics is not as cl

Glue Dispense Process Control

Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman

Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Thu Sep 13 13:29:06 EDT 2001 | mparker

Dave et al, I just print out and read a copy of the aforementioned recommended article. Mr. Mangin gives a clear picture of why DPMO is to be considered a more pure data than First Pass Yield (FPY). However, I must note that his interpretation of h

PCB finish - Printhead vs Squeegee

Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake

Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall


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