Electronics Forum | Fri Mar 06 22:52:16 EST 1998 | Scott McKee
| I will be starting a conformal coating process soon, I am looking for any pointers on | 1) Best method for masking components, tape mask, liqued mask Masking tape or rubber caps will work, the ligued mask is too hard to remove. | 2) Which is best
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Fri Jan 16 23:46:38 EST 1998 | Scott
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Tue Jan 13 13:39:30 EST 1998 | Matt Brown
| I am currently producing a Charity Report for The SMART Group on DSRS which the Group will sell and all the money goes to Charity. Does any one know of any good articles they can send me on double sided reflow assembly ? | I feel that there are onl
Electronics Forum | Thu Jan 08 11:17:14 EST 1998 | Richard
| A potential purchaser of our products (switchmode power supplies for telecommunications) has asked what the benefits of SMT are to him. | Our marketing people wish to obtain a list of the benefits of SMT to the purchaser of the end product. i.e. th
Electronics Forum | Tue Dec 30 20:31:11 EST 1997 | Jon
I suggest that you look at a few things: 1) The SMD pads may be too small for the part. Try to conform with the IPC standards in pad design. 2) The parts may be misplaced during the placement process. Tweek the placement program and if that doesn'
Electronics Forum | Tue Nov 27 15:37:15 EST 2001 | Dave G
I've seen some glass melf's fall off in our facility due to the glue not adhering to the body very well. You could pick these off with your finger after they had cured. (With little or no effort - I never bothered to actually measure the force requir
Electronics Forum | Tue Sep 18 13:58:01 EDT 2001 | ert002
50%) only over the appertures where there was poor support. Most prints took 2 knead strokes to print OK, but this caused fine pitch leaded devices to almost short. stencil had to be be wiped after kneading. 2 similar devices with exactly the same
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