Electronics Forum | Wed Feb 01 02:39:16 EST 2017 | jgo
80 micrometres (0.08mm)
Electronics Forum | Thu Mar 16 17:33:40 EDT 2017 | dontfeedphils
Voiding, fracturing, barrel-fill, I'm sure there are some I'm missing.
Electronics Forum | Sun Feb 24 09:10:47 EST 2019 | spoiltforchoice
That is what eSims are for.... For everything else use a socket
Electronics Forum | Mon Sep 23 01:42:35 EDT 2019 | sssamw
yes, socket on PCB, SMD type
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Tue Nov 14 16:06:27 EST 2000 | zorox
We have an ERSA machine here where we have solder "spikes" occasionally. We have made sure our flux is dispensing properly, we have adjusted z axis speeds, our preheater is heating properly, adjusted XY speeds, etc. Can anyone think of something we m
Electronics Forum | Mon Dec 27 17:47:27 EST 1999 | Rob Thomas
A more efficient and cheaper way of reballing bga's would be to use the Solder Quick bga preforms made by Winslow Automation. It is a very simple process .I've been using it for over six months and it works fine.They have a website winslowautomation.
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
