Electronics Forum: hope (Page 193 of 341)

Wave SPC

Electronics Forum | Thu Sep 27 10:28:29 EDT 2001 | John S

It seems to depend on your situation. We're an OEM manufacturer and run the same products for extended periods of time. We monitor process indicators such as Dave listed, but we also monitor process defect trends. This is product specific of cours

Placement Program Tweaking

Electronics Forum | Mon Oct 15 23:30:35 EDT 2001 | Ivan Rojas

Well Dave ,,, ,, first thing I should do ,, is check my CAD data , and make sure match with the program in the pick and place machine ,, right now I work with Siemens and GC-Place ,,, In my case it may be other things to look for ,,, if is everythin

The glue with the holes...

Electronics Forum | Wed Oct 17 10:21:08 EDT 2001 | genglish

Cheers guys for your rapid response, I investigated the problem further today, eventually I cam round to curing the adhesive in a sandwich of microscope slides resting on the PCA in question (hopefully mimicking the heat transfer), the adhesive is sp

Need info on Vitronics SMD-310

Electronics Forum | Tue Oct 23 08:38:52 EDT 2001 | MikeF

Dave, Thanks for the suggestion on the used equipment brokers. I had done a search of the Marketplace for this machine, but should have thought to contact one of the brokers. Vitronics can sell me a manal, but has noted the manual does not have any

Product Changeover (SMT double sided)

Electronics Forum | Fri Oct 26 11:37:27 EDT 2001 | Dave G

You could start by putting together a matrix of P/N's vs product. This will tell you which parts are common with most of your jobs. These would then become part of a fixed feeder setup that would stay on the machine. (These will probably be mostly R'

BGA solder joint VS. X-Ray machine capability

Electronics Forum | Mon Nov 12 11:40:50 EST 2001 | caldon

Your broad question will bring many answers.You do not mention PCB type which plays a key part in the inspection specs you look for. Your question is like asking "What is the best automobile?" You will have 1,000,000 answers. Best answered this way:

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve

Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men

My Data

Electronics Forum | Wed Dec 05 22:38:40 EST 2001 | Ivan R

Hello Chris , Well I have work with MYDATA , QUAD and PANASONIC before and now with SIEMENS that is my background to reply to your question . What I can tell you is that MYDATA is the easier machine to fix any equipment breakdowns and that does

Machine good/bad points

Electronics Forum | Fri Mar 22 18:35:05 EST 2002 | cnoonan

It depends on your application. Are you going for high volume low mix, or low mix high volume? What is your expense budget? What are your factory space requirements? I have worked with Fuji, Siemens, Universal, Panasonic, and Mydata. My pref

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng

We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the


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