Electronics Forum | Mon May 25 23:26:19 EDT 1998 | Jon Gruett
I agree with Mike. They are a dead issue. As a manufacutrer's rep for many types of equipment and 11 years in the engineering field I have seen several attempts to revive the technology (if you can call that technology). Most if not all attemptds
Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef
Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Tue Dec 12 13:33:52 EST 2000 | justin medernach
Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving that agitate the solder, the more dross. Basics first and then the answers will make sense. What is dross? Oxidatio
Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
