Electronics Forum | Wed Feb 07 13:44:09 EST 2007 | dsoohoo
After some precursory experimentation, I am planing on employing a form of low melting temp solder for use in reworking some very dense, copper core PCB's, both SMT and THT, which were originally mounted with 63/37 solder. The main problem with the
Electronics Forum | Fri Jul 20 07:09:29 EDT 2007 | chrispy1963
Sr. Tech, youre absolutely correct that the X-Wagon (pancake) motor is the one which will do final positioning when moving to a programmed position. The X Axis motor in back of the machine is used for rapid traverse of the axis. I was thinking more
Electronics Forum | Fri Sep 24 15:04:29 EDT 2021 | dwl
A few random thoughts: Nitrogen in reflow is mostly cosmetic, to get shiny joints on lead free. If you are getting good results without nitrogen now, there's no need to add it on your new line. Since power consumption is important, I would get spec
Electronics Forum | Thu Mar 22 13:41:41 EST 2001 | mparker
What's the reality of the situation? Are you creating a specmanship issue here just to satisfy Class 3? Can you demonstrate that the paste volume applied to the plastic QFP's give sufficient overall fillets for mechanical and electrical properties? W
Electronics Forum | Thu Apr 19 11:04:43 EDT 2001 | Spanky
All, We are getting ready to start running with 0201 passives. I have never run these before. We have run some 0402s however. We don't have any assemblies in-house yet, so I can't give any intelligent information regarding the board design (size,
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Tue Sep 28 10:29:11 EDT 1999 | Earl Moon
| Dear all, | | We've got a curious problem. We have had a major problem with BGA's occasionally being placed one to several rows or columns off the pads. We are using Universal's GSM2 platform for our general purpose placements. Our Universal re
Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
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