Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Thu Jan 16 10:14:56 EST 2003 | barrett1
I have been using silver coated boards for over 3 years and with a Qualitek No-clean solder paste and have used primarily the same convection reflow profiles as Hasl boards.
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Thu Jun 27 13:33:21 EDT 2019 | duchoang
Wash the board or do what ever to get rid of flux /flux residue at the parts before running second side. If you can, use special reflow profile for the second side ( Less heat for bottom side).
Electronics Forum | Thu Nov 07 10:07:02 EST 2019 | charliedci
Requesting help from anyone with experience in reflowing Te Connect, PN 1565917-4, 200 pin connecter. Pic attached. Cannot get all 200 pins to wet, main suspect is slight PCB warping during reflow. Have adjusted reflow profile. A 2.75 inch long SMT c
Electronics Forum | Fri Jan 19 07:26:45 EST 2007 | Richard-magictek Tech
kindly send me your reflow profile ---and also the PCB lay out i shall able to determine your process flow on speed....and glue application i can be reach at this email- rdm@magictek.com.cn my web site is ;www.magictek.com.tw we are furance maker w
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Wed Feb 07 16:16:10 EST 2007 | mr
I have seen this before. Check: --Vibration of belt --Interference (part getting "brushed off" while reflowing bottom-side components --Some glues' cross-linking mechanism is impaired by the flux during migration in reflow, redering the glue useless
Electronics Forum | Sun Mar 20 12:58:23 EDT 2011 | sellenzz
We have a Nitrogen Silo. Your going to want to be careful if you decide to use nitrogen, not only are the levels unstable most of the time but it can also cause your components to tombstone like crazy, especially if you run a lot of LED's. We run 24/
Electronics Forum | Thu Oct 13 18:20:14 EDT 2022 | proceng1
I also believe it is the cause of the issue. I guess you could make a fixture that clamps the board flat. Then you'd have to change the reflow recipe. How was the recipe created? Did you actually profile a populated board or just use a recipe that
