Electronics Forum: thermal (Page 195 of 208)

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 15:27:36 EDT 1998 | Dave F

| | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and s

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 20:18:09 EDT 1998 | Justin Medernach

| | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 21:27:33 EDT 1998 | Earl Moon

| | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered a

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Wed May 27 11:19:34 EDT 1998 | Earl Moon

| | | | | | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BS

Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX

MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha

Re: PASTE LEACHING

Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F

Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.

Re: Tape residue cleaner

Electronics Forum | Fri Apr 07 17:17:55 EDT 2000 | Dave F

Ashok: You should select and use low residue tapes. But ya know, ya go out and research a great tape and if yer not careful, the buyer will second source ya and (surprise) ya got residues again. We have found that Lemme say this about Katon tape

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

via as test point

Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef

First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us


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