Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
Electronics Forum | Fri May 03 18:10:17 EDT 2002 | stownsend
Okay, here goes another thread about gold plating. I have been using gold plated PCB's for about two years now, with mostly very good results. The main reason I started using gold in the first place was because it is flat, solder wets to it nicely,
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Thu May 09 17:16:16 EDT 2002 | davef
Russ makes a good point. While your profile probably meets your paste supplier recommendations, it may not be proper for the component. * Paste suppliers offer general recommendations for tin / lead interconnects. You need to modify that for board
Electronics Forum | Wed May 22 21:01:49 EDT 2002 | davef
Ah, the customer is always correct, again. And you are officially �painted into a corner�. Actually, your customer is not correct. Thinking that money is going to be saved by specifying copper component terminations [or whatever in the world they
Electronics Forum | Mon Jul 15 15:06:35 EDT 2002 | tmv
The focus of this discussion thread seems to have shifted. To bring it back around I offer the following.... It will absolutely be a far different landscape within a year. Those who survive might not be the biggest or the best....but the smartest. T
Electronics Forum | Thu Sep 05 13:49:05 EDT 2002 | dragonslayr
Cal- I am so ass-hamed for getting right to the end user stuff and forgetting about the process parameters. You are so right in pointing out the obvious lack of technical data. The raw materials include Hostess Twinkies, frying oil or grease and pow
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
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