Electronics Forum | Fri Sep 27 17:42:35 EDT 2002 | russ
i don't know of any "handy dandy" but something I use is tape width minus 4mm for the max component size that can be fit into tape widths of up to 32mm. 32mm and larger have holes on both sides which would then be tape width minus 7mm. I have never
Electronics Forum | Mon Oct 07 13:15:41 EDT 2002 | razorsek
Russ, this post doesn't specificly address your original post but I thought it is relevant to your situation and future production. I have been having problems with voids using Kester's R596L paste. I contacted them for a solution to my problem. T
Electronics Forum | Fri Oct 04 01:18:27 EDT 2002 | sarge
1.5. Width >= 4-5 Particle Diameters. Use the smallest opening to determine this. Using dimension of the smallest aperture width, you should be able to fit minimum of 4-5 solder balls side by side into the opening. For 0201 design, -400 mesh (type
Electronics Forum | Tue Oct 15 12:07:55 EDT 2002 | kenbliss
Hi Jason First, I would not use real parts to test. Second talk to your cardboard box supplier they should be able to advise you on this, they should have the test results from the box capacities they sell to start with. Are you using this tote bo
Electronics Forum | Mon Oct 21 18:15:13 EDT 2002 | cnoonan
Fuji: Wonderful machine, very robust, Hardware second to none. Lacking on software Universal: Love the GSM, great platform. Sanyo HSP�s are ok, like the new 4796, not sure about the 4797 yet, have not had it long enough to give good data. Sieme
Electronics Forum | Tue Oct 22 13:28:03 EDT 2002 | slthomas
Brian, Since the change, I have seen numerous instances of extra zeros being added to numeric values, typically those of 3 (original) characters or more. Case in point, a contribution by our friend Mr. Fish that I have cut and pasted: "The steadfa
Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Thu Oct 31 09:34:38 EST 2002 | russ
We do this all of the time, This is what we do but I would be interested in other methods. 1. Remove component with BGA type rework station 2. Wick off lead pads only, verify/create even solder surface on the thermal pad on the board 3. Apply no-cle
Electronics Forum | Fri Dec 13 10:40:08 EST 2002 | MA/NY DDave
Hi I hope more post on this one. Since it interests me and I haven't read enough on this topic in recent years. Donoughts with a dot in the middle I have seen. The dot in my opinion could be over or under etched or plated with the center of the do
Electronics Forum | Fri Jan 10 10:09:42 EST 2003 | mantis
Hi In selecting or substituting a capacitor for use, consideration must be given to (1) the value of capacitance desired and (2) the amount of voltage to be applied across the capacitor. If the voltage applied across the capacitor is t
