Electronics Forum | Mon Dec 08 07:44:03 EST 1997 | Mika Johnsson
| I would like to hear from anyone producing high mix (~200 modules) with low volumes (5-2000 per year) using an automatic line running lot sizes in the 5-50 range. We are engaged in an investigation to invest in this capability. A view into the or
Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman
Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found
Electronics Forum | Fri Aug 24 19:08:17 EDT 2001 | stefo
Happy Friday All! Well, it seems another "opportunity" has presented itself to me. Looking to assemble a 24" X 24", 52-layer board... piece-o-cake, right? Not real sure of all the components that are on it, but I do know that there is some 20-mil
Electronics Forum | Tue Oct 09 20:40:48 EDT 2001 | davef
No one suggested that you speak for other suppliers and nor would they want� you �to speak for them." You shouldn�t make this something that it isn�t. All that was requested courteously was suggestions of alternate suppliers that could be considere
Electronics Forum | Wed Sep 05 12:11:03 EDT 2001 | seand
Hello Michael, Laser marking and ink jet marking are now offered by a wide array of suppliers. The was a bit of a boom at APEX last year in the number of suppliers for these systems. Many have tried label placing but have run into a number of conc
Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake
Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
