Electronics Forum: air (Page 197 of 257)

Mysterious reflow problem

Electronics Forum | Wed Sep 23 03:43:31 EDT 2009 | d0min0

hello, we are profiling with the pcb each day - results are very good with a small delta we made another test board with TC only in the problem places - same good result we tried 500-600 boards on 12 zone machine - zero defects while on standard 6

gpu removal

Electronics Forum | Wed Sep 16 15:12:08 EDT 2009 | squid

hi i have just brought a hot air rework station to remove a gpu on xbox 360 i have removed the chip but three of the pads have gone a brownish color and seem like solder will not stick to them ,does this mean the chip is ruined ? ,if so is it becaus

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135

@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the

BGA VRAM Reworking

Electronics Forum | Mon Dec 07 16:40:37 EST 2009 | jkomets

I have a number of computer parts with faulty VRAM. I have two high-end video cards and a laptop motherboard, each worth over US$100, and some other parts worth less. They all exhibit symptoms typical of faulty VRAM; that is, they display multicolore

Temperature Profiling

Electronics Forum | Thu Dec 10 16:57:32 EST 2009 | vetteboy86

I'm just getting into temperature profiling our PCB's. We recently bought a new reflow oven. The company purchased a mole before I was hired. This is what I will be using. What is the preferred way to attach the thermocouples to the PCB locations of

Temperature Profiling

Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman

In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi

via capping

Electronics Forum | Mon Jan 11 14:48:44 EST 2010 | davef

SR1000 is commonly used for tenting. Search the fine SMTnet Archives on : tenting Someone gave us this note. We have lost their name. It seems to be good advice. If Liquid Photo Image (LPI) solder mask is required, do not tent via holes. Tenting

Solder paste transfer from jar to cartridge

Electronics Forum | Tue May 11 08:21:16 EDT 2010 | nrw

Hello, I am in the process of setting up processes for a low volume SMT line for internal prototype production, where a 500g jar of solder paste would last weeks. Our distributors only seem to want to supply 500g jars (anything else is significantl

Solder paste transfer from jar to cartridge

Electronics Forum | Tue May 11 15:56:10 EDT 2010 | davef

First, you mix the paste in the jar with the centrifugal thing-a-ma-jig. Then what? So, how are you going to get the paste from the jar into the syringe [cartridge], anyhow? Are you going to use an Atlas Tool? How are you going to de-air the syri

BGA

Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk

HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi


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