Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Mon Feb 13 16:24:39 EST 2006 | samir
SPC was a fad of the '80's and has been mis-used by the igonorant for decades now! Doing SPC on defects is a case in point. Hell I implemented wave SPC programs before eating breakfast at 2 previous companies, and they worked great..resulting in 25
Electronics Forum | Tue Mar 07 15:11:43 EST 2006 | davef
We wouldn't know a Gemini from a bread box, nor we are real clear on what you seek. So, we'll just rattle on for a while. Here's how we monitor the quality of our dispensing process: * We dispense the same nonfunctional pattern of dots on every boa
Electronics Forum | Sun Apr 09 14:20:17 EDT 2006 | greatexpectations
Hi, This setup was recommended. Target is 20,000 board output per day FUJI GL-541 Glue Dispenser (USED) 32K FUJI GL 641 SCREEN PRINTER (USED) 57K CP-643E CHIP SHOOTER 255K (150 FEEDERS) FUJI QP-242E IP3 110K REFLOW 8 ZONE (IS THIS ANY GOOD) 4
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Tue Apr 25 10:13:17 EDT 2006 | slthomas
What kind of parts are on the bottom? Small passives are very unlikely (won't unless other abnormal factors come into play) to fall off when reflowed a second time regardless of temperature differential. There is a simple weight/soldered surface ar
Electronics Forum | Wed Apr 26 16:10:53 EDT 2006 | muse95
I find is fascinating that a lot of people blame the Pbfree finish before anything else, as if this is some new and scary thing. It MAY be a contributing factor, but I doubt it is the main or only issue. When we started evaluating our BOM's 1.5 ye
Electronics Forum | Mon May 22 18:19:29 EDT 2006 | Steve
I have read some threads about poor wetting on palladium-silver (Pd-Ag) coated components. I followed the suggestions, but I am still having a problem. The part is an 0603 chip type (Vishay varistor). The Process: solder paste is lead-free Alpha Met
Electronics Forum | Thu Jun 08 05:58:39 EDT 2006 | Base
Hi Efren, Did some simple math... - 100k units/month - 24 days/month - 16 hrs/day - 75% efficiency (ballpark questimate) You'll be looking at a line that does a bit more 50kCmp/hr with an IC/TH placer that does 3.5kCmp/hr (assuming 10 IC's /TH conn
Electronics Forum | Tue Jun 27 08:38:03 EDT 2006 | cuculi54986@yahoo.com
I tried some SN100C from AIM... On only one array. It flowed well on the chips but did not like the finish on the SOT23's on the board. I did not have enough arrays to mess around, so we switched it over to SAC305 and had no issues. I'm guessing w
