Electronics Forum | Mon Aug 21 12:08:36 EDT 2000 | Dason C
Hi! I had experience with my customer complain about the delamination on BGA. The first question, I will ask my customer how they removed the parts and de-cap (my customer is using de-cap instead of SEM, I prefer SEM). Most of the customer which I
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Thu Jul 06 07:30:46 EDT 2000 | John
Ralph, Typically our co-op students put down solder paste with a syringe, place the parts on the paste with tweezers, and then reflow the paste with a hot air pencil. This works pretty well when they are hand building prototypes. You can probably
Electronics Forum | Wed Jun 21 22:07:09 EDT 2000 | Jason
We are going to try double sided reflow for the first time. Can we use the same 63/37 paste on both sides? The board also has bare copper pads i'm pretty sure. will this present any challenges? The bottom side has a QFP on it. Should it stay on?
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Mon Jun 12 10:57:51 EDT 2000 | Jason
I am new to wave soldering. Any information is greatly welcomed. Here is the problem. After soldering the boards they have a film on the bottom of them and sometimes a white powder looking substance. I have tried decreasing the amount of flux on
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Thu Apr 20 09:49:01 EDT 2000 | Dave
Why worry about the temperature if the top of the chip is 20 degrees C above eutectic - 183 C(at the balls)...if a machine works at convection oven temperatures, with high power, then there's no need to worry...Also, a CSP is a very forgiving chip.
Electronics Forum | Tue Apr 11 20:37:06 EDT 2000 | Dave F
Rich: Now that�s a great question!!! You�re corrrect. Primary-side temperature is the driver of the differences in the sensitivity to moisture between SMT and PTH devices that you�re finding. * Primary-side temperature for SMT ~= Secondary-side te
