Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
Electronics Forum | Wed May 05 09:59:44 EDT 1999 | Erick Russell
Several of our customers use our Summit series equipment for this purpose. Our rework stations are used in proto labs to prove manufacturability. Consider it a low volume, semiautomatic pick and place and selective soldering reflow oven. Some low
Electronics Forum | Fri Apr 30 10:34:16 EDT 1999 | Ryan Jennens
Mornin! We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be advantag
Electronics Forum | Tue Apr 27 13:41:16 EDT 1999 | Scott McKee
| i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks | There are sooo many variables; product size, 1 vs. 2 sided boards, support, component size, pitch, stencil alignment, PCB thickness,
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Mon Apr 19 08:50:46 EDT 1999 | J.H.
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Apr 13 09:50:18 EDT 1999 | Dave F
| Hello. | | I'm now investigating the current technological issues | on surface mount devices. | For example, I want to know the limitation of | the surface mount machine. | | Where can I get the materials for this purpose? | | Thank you | Cho
Electronics Forum | Wed Apr 07 08:38:33 EDT 1999 | Dave F
| | | I need help in finding solder paste measuring equipment. | | | | | Cuch: What aspect about paste are you trying to measure? | | | | 1 Paste qualification? | | 2 Incoming quality? | | 3 Print volume? | | | | Dave F | | | mostly looking for
