Electronics Forum: use (Page 1963 of 2489)

adhesive on pads

Electronics Forum | Fri Mar 29 17:58:21 EST 2002 | slthomas

We have a new assembly with bottom side components, and all the chip caps and resistors are 0603s. The dog boned shape of the caps necessitates a pretty big (and tall) dot to hold them still during placement, and when they get placed the dot squishe

adhesive on pads

Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas

* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo

Process control, SMT inspection and rework

Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk

Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to

Universal instruments registration

Electronics Forum | Thu Apr 18 09:20:58 EDT 2002 | huey

Having been the G.M. of Universal's remanufacturing division for 10 years I am familiar with the "Third Party Support Policy" as I was the primary author of it. The primary reason the policy was developed was to make it more difficult for other rese

Universal instruments registration

Electronics Forum | Fri Apr 19 09:29:05 EDT 2002 | stefwitt

Capital Investment International consolidates the many owners of Dover, which may make business a bit more difficult compared to most of the competitors, who don�t have to spend a large percentage from profits to their owners. The poor business decis

Failure Mode Effects Analysis (FMEA)

Electronics Forum | Fri Apr 19 15:49:56 EDT 2002 | davef

While our group is not involved in product FMEA, periodically we get dragged, kicking and screaming, into a FMEA for: * Quoting the assembly or test of products. * Evaluating the potential purchase of process equipment. * Assessing the potential impa

BGA rework

Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil

2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls

First Article Inspection

Electronics Forum | Sun May 19 21:01:51 EDT 2002 | ianchan

Hi mates, we only do a double side tape sample for 1st pcs output, buyoff the location vs P/N, and orientation. we can recycle use of "A-items" eg. IC... once all this is affirmed, we mass run the rest of the Lot size, via full SMT line configuratio

Are US OEM Manufacturers Dead?

Electronics Forum | Sat Jun 01 18:00:19 EDT 2002 | stefwitt

I guess we can only speculate about the outcome of this recession. By shifting manufacturing to China, we also transfer technology and know how. If just the market of telecommunication takes off, boards of the latest technology ( flip chip, wafer fe

Solder particals in the oven?

Electronics Forum | Wed Jun 05 13:21:11 EDT 2002 | Hussman69

That's OK, as long as you didn't say breading, I knew what you meant. Well, for a quick fix try placing Kapton tape over the gold. It's not a cure, but gets you product. Next try putting a couple of non-screen printed boards thru the oven and se


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