Electronics Forum | Fri Oct 18 21:23:55 EDT 2002 | caldon
David- You are correct!!! DING DING DING!!!! Here is an overview from the ACI website: ACI offers solderability restoration services by using Reduced Oxide Soldering Activation (ROSA) technology to remove the oxide layers from circuit boards or comp
Electronics Forum | Wed Oct 30 16:05:08 EST 2002 | msimkin
Hi, I have received a report form a board supplier, analysing the reuslts form non wetting problems we have been expereincing with their boards. I assumed it was due to the gold layer being too thin, thus allowing the nicklel layer to be exposed and
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Thu Dec 12 07:37:13 EST 2002 | davef
Immersion plating appears like electroless, sorta, but is different chemically. Plating is converting metal ions in solution to metal on the board. Those metal ions are "converted" by adding electrons to them. The source of these electrons defines
Electronics Forum | Mon Dec 23 18:06:38 EST 2002 | jersbo
Tried and True is counting your components if there is any indication of loss... this is a great TOPIC... unfortunately there are many ways to lose components. Feeder setup,problems with a feeder while in the machine(IE mylar problems or wrong step)
Electronics Forum | Fri Jan 24 11:45:58 EST 2003 | Randy Villeneuve
I am not familiar with your flux but with no-cleans (which I use) the primary cause of icicling is the amount of flux solids left on the board prior to wave and how long the board is in the wave (2.5 to 3.5 seconds should be OK). The amount of flux s
Electronics Forum | Fri Feb 28 17:28:06 EST 2003 | Garth
I am looking for suggestions for software for use in productions scheduling. I want my senior assembler to be able to enter the projects that are upcoming or ongoing so that I know when certain builds are finished. That way I know when the boards a
Electronics Forum | Fri Mar 07 15:20:11 EST 2003 | davef
O'Connor: IPC-A-610, section 12.4.4 SMT Soldering Anomolies - Nonwetting was added primarily to accomidate OSP boards. Heated flux is used to remove the 'lacguer'. So, you end-up with a copper colored border [or shadow] around the pads, where there
Electronics Forum | Mon Mar 10 16:29:34 EST 2003 | kenBliss
You can call it anything you want. At the end of the day what matters is what you are able to produce in a given period, say 8 hours. How many components where placed during that time. Most engineers do not fully understand that there is generally
Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ
Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t
