Electronics Forum | Fri Apr 20 16:11:29 EDT 2001 | davef
Good to talk with you too. Oh, just the way I had it pictured!!! Yeh, right!!! [http://davesmt.50megs.com/pictures select kristenna.jpg ] Which part of the antenna "sees" heat first [Are all legs (vertical part), two legs, or one leg of the anten
Electronics Forum | Wed Apr 18 20:55:20 EDT 2001 | davef
Yins are bad, this guy's serious. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically and electrically
Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee
The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen
Electronics Forum | Thu Jul 20 15:37:53 EDT 2000 | Tekguy2000
These parts are flat chip resistor arrays that have 4 end terminations on each side. It looks liek an IC but is typically in an 0805 and 1206 package type with convex terminations. .031" pitch from termination to termination and .011" spacing between
Electronics Forum | Tue Jun 05 06:45:46 EDT 2001 | jackofalltrades
I am not in your area to provide physical assistance, but I'm full of advice. Keep in mind you get what you pay for. One thing you can do is what you have done here, watch this forum and others like it. You will see where the short comings are. Obvio
Electronics Forum | Mon Jun 25 20:59:51 EDT 2001 | davef
As Wolfgang says: Conveyor speed may be too high. Excuse me for not stripping-out my repetition from your list, but other machine adjustments to consider are: * Using more efficient [higher specific gravity] flux. [Got it!!!] * Adjusting wave shape
Electronics Forum | Mon Feb 07 19:49:50 EST 2000 | Tony Di Mauro
Jose, I have seen this defect before. We called it re-reflow. We found the part was originally attached at SMT. Later on after seeing a heat cycle at the wave machine the leads would de-attach causing an open at In-Circuit Test. Resolution was t
Electronics Forum | Mon Jan 17 21:01:21 EST 2000 | Dave F
Dennis: On your BGAs: * Never seen voids any place other than the top ... lower density stuff rises. * Our spec on voids says: 1 Voids 1a Voids in soldered balls shall be less than 20% of the diameter of the solder ball. 1b No void shall sho
Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F
Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b
Electronics Forum | Tue Jan 11 11:14:09 EST 2000 | Wolfgang Busko
What a challenge! I think it all depends on the equipment used. Seems rereflow of BGA isn�t that good (see the advices for wavesoldering BGA populated boards). Although you might check for the tacking force by sending a sample BGA board head over thr
